Materials for Advanced Packaging

Daniel Lu, C.P. Wong

book

Published: 2008-12-17

Pages: 724

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.

Genres